| feature | Ability distinction | |
| standard | special | |
| material | Rigid board: FR2, CEM-1, CEM-3, FR4 (Standard – Halogen Free – High Performance) Including: Shengyi, Lianmao, Shanghai Nanya, Taiyao For more information on material availability, Please contact Jiajietong technical contact Huang Kaifeng 183 0183 3539 | For more information on material availability, Please contact Jiajietong technical contact Huang Kaifeng 183 0183 3539 |
| Minimum dielectric layer thickness | 0.05mm rigid board | 0.025mm hard board |
| layers | 2 - 26L Quick Delivery | 40L (sample trial production) |
| Via Copper Plated Fill (Yes/No) | no | no |
| Through hole copper paste plug hole (yes/no) | able | able |
| Hole in plate (Yes/No) | able | able |
| Laser Direct Imaging (Yes/No) | able | able |
| Maximum Delivery Dimensions (mm) | 609 x 508 | 1204 X 560 |
| Minimum board thickness double sided board (mm) | 0.30mm rigid board | 0.20mm rigid board |
| Minimum plate thickness over four layers (mm) | 0.60mm rigid board | 0.45mm rigid board |
| Maximum plate thickness (mm) | 4.0 | 10.0 |
| The minimum line width and line spacing of the inner layer (mil) depends on the copper weight | 0.05mm | 0.05mm |
| The minimum line width and line spacing of the outer layer (mil) depends on the copper weight | 0.05mm | 0.05mm |
| surface treatment | Immersion Gold/Gold Finger/Organic Antioxidant/Immersion Silver/Leaded HASL/Lead-free HASL/Gold Plating/Nickel/Immersion Tin/Gold Finger+Organic Antioxidant/Gold Finger+Lead-free HASL/Organic Antioxidant+Immersion Gold/Immersion Silver+Gold Finger/Immersion Tin+Gold Finger/Nickel Palladium Gold | Immersion Gold/Gold Finger/Organic Antioxidant/Immersion Silver/Leaded HASL/Lead-free HASL/Gold Plating/Nickel/Immersion Tin/Gold Finger+Organic Antioxidant/Gold Finger+Lead-free HASL/Organic Antioxidant+Immersion Gold/Nickel Palladium Gold/Immersion Silver+Gold Finger/Immersion Tin+Gold Finger |
| Alignment Tolerance Between Layers | 0.05mm | 25μm |
| Min Mechanical Drilling (mm/mil) | 0.15mm | 0.10mm |
| Via Thickness Aperture Aspect Ratio | 10:1 | 12:1 |
| Finished Hole Tolerance (Via) | ± 0.076mm | ± 0.05mm |
| Complete Hole Tolerance (Non-via) | ± 0.0375 | ± 0.025 |
| Maximum outer layer copper thickness | 6oz | 120oz |
| Maximum Inner Layer Copper Thickness | 4oz | 6oz |
| Impedance Control Tolerance (+/- X%) | Other ± 10% | ± 5% |
| Solder Mask Via Plug Hole IPC4761 Type 6 (Yes/No) | able | able |
| Resin Via Plug Hole IPC4761 Type 6 (Yes/No) | able | able |
| Resin Via Plug Hole IPC4761 Type 7 (Yes/No) | able | able |
| | It is worth noting that even with 'standard' technology, this does not mean that all aspects can be achieved by all plants When using combinations of these parameters, you should always consult Jiajietong technical contact Huang Kaifeng 183 0183 3539 | |
