| Classification | project | production capacity |
| Inspection standards | Acceptance Criteria | Civilian products, Class 2 products | IPC-A-600 IPC-6013 GJB7548 |
| Military products, grade 3 products |
| experiment method | IPC-TM-650 GB/T4677-2002 |
| file processing | Handle file formats | Tango/Pads2002 |
| Protel series |
| Powerpcb/Genesis |
| dxf/dwg |
| Gerber file format | Photopainting file (Gerber file) and corresponding drilling file |
| Flexible substrate (adhesive-free, rolled copper) | Xinyang, Shengyi | PI thickness 1/2/3/4mil, copper thickness 1/2, 1Oz |
| Panasonic RF775/RF777 | PI thickness 1/2/3/4mil, copper thickness 1/2, 1Oz |
| Dupont AP | PI thickness 1/2/3/4mil, copper thickness 1/2, 1Oz |
| CVL | Epoxy adhesive system (pine poplar) | PI thickness 0.5, 1mil, glue thickness 1mil |
| Acrylic adhesive system (DuPont) | PI thickness 1mil, glue thickness 1mil |
| Prepreg | Shengyi SP168GL | 1067, 1078 |
| Tenghui VT447 | 1067, 1078 |
| Outer copper foil | 18, 35, 70um |
| PI reinforcement | Acrylic glue | PI thickness 4/8mil, glue thickness 1mil |
| Pure rubber | Epoxy glue system/acrylic glue system | 40um thick |
| Shielding film | SF-PC6000 |
| Dimensions | layer | 1-8 floors |
| Finished board size (maximum) | Single side (not press CVL) | The shortest side is up to 480mm, and the long side is not limited |
| Single side (need to press CVL) | The shortest side is up to 230mm, and the long side is not limited |
| Double-sided (need to press CVL) | 470*580mm |
| Multi-layer soft board (3-8 layers) | Short side size 220mm, long side unlimited |
| Thickness of single-sided soft board (without PI reinforcement) | No pressure CVL | 0.04-0.08mm (sheet size 25-50um, copper thickness 18/35um) |
| Laminated CVL | Conventional 0.08-0.13mm (substrate sheet specification 25/50um, copper thickness 18/35um, CVL specification 12.5/25-25/25) |
| Maximum thickness 0.18mm (substrate specification 75/100um) |
| Double-sided flexible board thickness (without PI reinforcement) | Laminated CVL | Conventional 0.115-0.21mm (substrate sheet specification 25/50um, copper thickness 18/35um, CVL specification 12.5/25-25/25) |
| Maximum thickness 0.27mm (substrate specification 75/100um) |
| Multilayer board thickness | 0.3-4.0mm |
| Plate Thickness Tolerance | ≤0.5mm | ±0.05mm |
| 0.5-1.0mm | ±0.1mm |
| 1.0-4.0mm | ±10% |
| inner graphics | Minimum Line Width/Space | Base copper 18um | 3.5/3.5mil |
| Base copper 35um | 5/4mil |
| Base copper 70um (hard board) | 8/5mil |
| Inner minimum pad | 0.125mm (18/35um base copper), 0.15mm (70um base copper) |
| electrical ground isolation | 0.25mm |
| Drilling aperture range | 0.2-6.3mm (interval 0.05mm) |
| drilling | Minimum distance from drill hole to conductor | ≤6 layers | 8mil |
| ≤16 layers | 10mil |
| electrical ground isolation | same network | 6mil |
| different network | 12mil |
| Minimum NPTH hole | 0.5mm |
| Aperture Tolerance | ±0.05mm |
| Immersion Copper Plating | Hole Plating Aspect Ratio | 10:1 |
| Aperture | Minimum 0.2mm |
| outer graphics | Minimum Line Width/Space | H/H+plating | 4/3.5mil |
| 1/1+plating | 5/3.5mil |
| 2/2+plating | 9/5mil |
| Distance from conductive pattern to outer edge | Minimum 8mil |
| Grid Line Width/Spacing | H/H+plating | 6/6mil |
| 1/1+plating | 6/6mil |
| 2/2+plating | 10/8mil |
| Solder mask | Solder mask bridge width (minimum) | green oil | 4mil |
| Other variegated ink | 5mil |
| Solder mask color | Green, blue, yellow, red, white, black |
| Minimum window size on one side of solder mask | 2.5mil |
| Minimum unilateral width of solder mask line | 2.5mil (partial 2mil) |
| characters | character color | white, yellow, black, gray |
| Pad to character minimum pitch | 6mil |
| Character Line Width/Character Height | Base copper 18um | Character width/character height: 4mil/27mil |
| Base copper 35um | Character width/character height: 5mil/30mil |
| Base copper 70um | Character width/character height: 6mil/45mil |
| surface treatment | lead HASL | Tin thickness 2-40um |
| Electroplated gold fingers | Nickel thickness is 3-5um, gold thickness is 0.125-0.254um, the maximum finger length is 2inch, and the minimum finger spacing is 7mil |
| OSP | Film thickness 0.15-0.3um |
| Lead-free HASL | Tin thickness 2-40um |
| Shen tin | Tin thickness 0.8-1.2um |
| sinking silver | Silver thickness 0.1-0.3um |
| sinking gold | Nickel thickness: 3-5um, gold thickness: 0.03-0.1um |
| molding | Milling Profile Tolerance (Edge to Edge) | ±0.15mms |
| Minimal arc of milling shape (inner angle) | 0.4mm |
| Milling slot minimum tolerance | ±0.15mm |
| VCUT | VCUT angle | 20°, 30°, 45°, 60° |
| VCUT angle tolerance | ±5°s |
| VCUT excess thickness tolerance | ±0.1mm |
| Impedance | control method | single-ended/differential |
| control tolerance | ≤50Ω | ±5Ω |
| >50Ω | ±10% |
| finished product | plate song | ≤0.7% |
| Packing | vacuum paper |
