Fast PCB

Technologies

HDI PCB

Fast PCB has a history of printing high-density interconnect circuit boards for nearly 20 years, and we have rich experience in producing high-density interconnect boards for different market applications. We work closely with advanced equipment suppliers, sheet metal manufacturers, and circuit board technology institutions, possessing comprehensive knowledge of the requirements and manufacturing methods for successful high-density interconnect products.

Fast PCB's technical support starts from the design stage of high-density interconnect circuit boards, providing manufacturing technology and experience to the design team to improve manufacturing capabilities and reduce total product costs. Our 10% sales come from the high-density interconnect segment, where we can manage new product introduction and rapid delivery design verification, seamlessly connect to mass production, and provide a reasonable and efficient process to quickly push new products to the market.


HDI PCB Capability table
control item ability
HDI Blind Buried Plate Order 6th order
Laser Aperture LV 6-3mil
mechanical drill 0.15mm
Laser layer medium thickness 0.15-0.05mm
Filled hole plating hole depth: ratio AR of hole diameter 1/1
Laser base PAD diameter mm (without compensation) ≥(LV+2MIL)
Filled hole plating hole diameter 6-3mil
Hole Filling Plating Hole Depth 0.12-0.05 mm
Minimum line width and line spacing 3/3mil
The minimum aperture of semi-metallized hole 0.4mm
Maximum production size 20*24in
Maximum Aspect Ratio for Mechanical Hole Plating 20:1
Line Width Spacing Tolerance ±20%
Impedance tolerance ±10%
PTH Hole Diameter Tolerance ±3mil
NPTH Hole Diameter Tolerance ±2mil
Plug-in Hole Diameter Tolerance ±2mil
Aperture Position Accuracy ±3mil
Hole Center to Hole Center Distance ±4mil
Hole to side spacing ±4mil
Alignment accuracy between layers ±3mil
Shape Tolerance ±4mil
Minimum Solder Bridge Green 3.5mil   Variegated 4.5mil
V-cut depth ±4mil
V-cut angle 30°   45°
V-cut accuracy ±4mil