Compared to traditional processes, the mechanical blind hole embedding process of Fast PCB can be optimized and streamlined, reducing costs to a certain extent. There is also better depth control capability in controlling the depth of blind holes.
At present, there is generally no limit to the drilling depth of mechanical drilling, which is much greater than the laser drilling depth (0.1mm). Therefore, the drug exchange ability is good, and horizontal line etching needs to be used to ensure sufficient time and avoid residual drilling contamination.

The AR ratio of mechanical blind holes is basically 1.2:1, which is higher than normal laser drilling. Conventional PTH electroplating lines are used to ensure liquid exchange in the blind holes and avoid the generation of micro bubbles.
The mechanical blind hole burying process mastered by Jiajietong can greatly shorten the production process, thereby saving costs, and has excellent hole depth control and good blind hole quality. The final product has very good reliability.