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Technologies

Resistance/Capacitance Embedded

The so-called buried resistance, also known as buried resistance or thin film resistance, is a technique of pressing a special resistance material onto an insulating substrate, and then forming an internal (external) material with the required resistance value through printing, etching, and other processes. It is then pressed onto the PCB board to form a planar resistance layer.
Resistance/Capacitance Embedded Capability table
Classification serial number project Project parameters remark
General Capability (Mass Production) Ultimate capability (sample)
1 Number of layers 2F~24F (normal structure) > 24 floors, ≤ 40 floors Limit capabilities are subject to review
2 Board thickness 0.254mm~5.0mm >5mm,≤10mm
3 Number of compressions 1~3 times >3 times,≤8 times
4 Resistance accuracy 10% 5%~8%